NASA Awards Boeing $30.5M for Radiation-Hardened Chiplet Design and Fabrication

Contract Overview

Contract Amount: $30,519,622 ($30.5M)

Contractor: THE Boeing Company

Awarding Agency: National Aeronautics and Space Administration

Start Date: 2017-03-31

End Date: 2021-02-28

Contract Duration: 1,430 days

Daily Burn Rate: $21.3K/day

Competition Type: FULL AND OPEN COMPETITION

Number of Offers Received: 3

Pricing Type: COST PLUS FIXED FEE

Sector: R&D

Official Description: THIS CONTRACT IS FOR THE DESIGN AND FABRICATION OF RADIATION HARDENED CHIPLET DEVICES

Place of Performance

Location: HAZELWOOD, SAINT LOUIS County, MISSOURI, 63042

State: Missouri Government Spending

Plain-Language Summary

National Aeronautics and Space Administration obligated $30.5 million to THE BOEING COMPANY for work described as: THIS CONTRACT IS FOR THE DESIGN AND FABRICATION OF RADIATION HARDENED CHIPLET DEVICES Key points: 1. Contract focuses on advanced R&D for specialized microelectronics. 2. Boeing, a major aerospace contractor, secured this award. 3. Potential risks include technological complexity and schedule adherence. 4. Spending falls within the R&D sector, specifically advanced electronics.

Value Assessment

Rating: fair

The contract value of $30.5M for custom chiplet design and fabrication appears reasonable given the specialized nature of radiation hardening. Benchmarking is difficult without specific technical requirements, but costs for similar advanced R&D projects can vary significantly.

Cost Per Unit: N/A

Competition Analysis

Competition Level: full-and-open

The contract was awarded under full and open competition, suggesting a competitive bidding process. This method generally promotes price discovery and can lead to more favorable pricing for the government.

Taxpayer Impact: Taxpayer funds are being used for critical technological advancement in space exploration hardware, with the expectation of a valuable return on investment through innovation.

Public Impact

Advancement of critical space technology for NASA missions. Potential for spin-off technologies benefiting other sectors. Supports high-tech R&D jobs within the aerospace industry.

Waste & Efficiency Indicators

Waste Risk Score: 50 / 10

Warning Flags

Positive Signals

Sector Analysis

This contract falls under the Research and Development sector, specifically focusing on advanced physical and engineering sciences. Spending benchmarks for highly specialized R&D like radiation-hardened chiplets are difficult to establish due to unique requirements and limited market.

Small Business Impact

The contract was awarded to The Boeing Company, a large prime contractor. There is no explicit indication of small business subcontracting in the provided data, suggesting limited direct impact on small businesses for this specific award.

Oversight & Accountability

The contract is managed by NASA's National Aeronautics and Space Administration. Oversight would typically involve technical reviews, milestone tracking, and financial audits to ensure progress and proper use of funds.

Related Government Programs

Risk Flags

Tags

research-and-development-in-the-physical, national-aeronautics-and-space-administr, mo, definitive-contract, 10m-plus

Frequently Asked Questions

What is this federal contract paying for?

National Aeronautics and Space Administration awarded $30.5 million to THE BOEING COMPANY. THIS CONTRACT IS FOR THE DESIGN AND FABRICATION OF RADIATION HARDENED CHIPLET DEVICES

Who is the contractor on this award?

The obligated recipient is THE BOEING COMPANY.

Which agency awarded this contract?

Awarding agency: National Aeronautics and Space Administration (National Aeronautics and Space Administration).

What is the total obligated amount?

The obligated amount is $30.5 million.

What is the period of performance?

Start: 2017-03-31. End: 2021-02-28.

What is the projected lifespan and performance improvement of these radiation-hardened chiplets compared to existing technologies?

The projected lifespan and performance improvement of these radiation-hardened chiplets are critical metrics for assessing the long-term value of this R&D investment. Without detailed technical specifications, it's challenging to quantify the exact gains. However, the primary goal of radiation hardening is to ensure operational reliability in harsh space environments, extending mission duration and data integrity, which represents a significant qualitative improvement over non-hardened components.

What are the key technical risks associated with fabricating radiation-hardened chiplets, and how are they being mitigated?

Key technical risks include achieving the required level of radiation tolerance, ensuring consistent performance across manufactured units, and managing the complexity of advanced fabrication processes. Mitigation strategies likely involve rigorous design verification, extensive testing at various stages of development, and close collaboration between NASA and Boeing's engineering teams to address unforeseen challenges during fabrication and integration.

How will the successful development of these chiplets impact future NASA mission capabilities and cost-effectiveness?

Successful development of these radiation-hardened chiplets is expected to significantly enhance NASA's mission capabilities by enabling longer-duration missions in deep space and increasing the reliability of sensitive electronics. This could lead to cost-effectiveness over time by reducing mission failures, minimizing the need for redundant systems, and potentially lowering the overall cost of future space exploration endeavors through more robust and durable hardware.

Industry Classification

NAICS: Professional, Scientific, and Technical ServicesScientific Research and Development ServicesResearch and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)

Product/Service Code: AEROSPACE CRAFT COMPONENTS AND ACCESSORIES

Competition & Pricing

Extent Competed: FULL AND OPEN COMPETITION

Solicitation Procedures: NEGOTIATED PROPOSAL/QUOTE

Solicitation ID: NNG16574410R

Offers Received: 3

Pricing Type: COST PLUS FIXED FEE (U)

Evaluated Preference: NONE

Contractor Details

Address: 325 J S MCDONNELL BLVD, HAZELWOOD, MO, 63042

Business Categories: Category Business, Corporate Entity Not Tax Exempt, Manufacturer of Goods, Not Designated a Small Business, Special Designations, U.S.-Owned Business

Financial Breakdown

Contract Ceiling: $31,401,818

Exercised Options: $31,401,818

Current Obligation: $30,519,622

Actual Outlays: $1,160,173

Subaward Activity

Number of Subawards: 33

Total Subaward Amount: $7,208,836

Contract Characteristics

Commercial Item: COMMERCIAL ITEM PROCEDURES NOT USED

Cost or Pricing Data: YES

Timeline

Start Date: 2017-03-31

Current End Date: 2021-02-28

Potential End Date: 2021-02-28 00:00:00

Last Modified: 2021-06-17

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