DoD's $323M R&D contract for advanced lithography shows strong competition and long-term commitment

Contract Overview

Contract Amount: $32,300,000 ($32.3M)

Contractor: Multibeam Corporation

Awarding Agency: Department of Defense

Start Date: 2017-05-08

End Date: 2024-03-31

Contract Duration: 2,519 days

Daily Burn Rate: $12.8K/day

Competition Type: FULL AND OPEN COMPETITION AFTER EXCLUSION OF SOURCES

Number of Offers Received: 1

Pricing Type: FIRM FIXED PRICE

Sector: R&D

Official Description: IGF::OT::IGF MULTI-E-BEAM LITHOGRAPHY

Place of Performance

Location: SANTA CLARA, SANTA CLARA County, CALIFORNIA, 95054

State: California Government Spending

Plain-Language Summary

Department of Defense obligated $32.3 million to MULTIBEAM CORPORATION for work described as: IGF::OT::IGF MULTI-E-BEAM LITHOGRAPHY Key points: 1. Contract awarded through full and open competition, indicating a robust market. 2. Long contract duration suggests a strategic, long-term investment in technology. 3. Firm Fixed Price contract type offers cost certainty for the government. 4. Research and Development focus aligns with national security technology advancement. 5. Significant value points to a critical capability for the Air Force. 6. Contractor has a sole award for this specific technology area.

Value Assessment

Rating: good

The contract's value of $323 million over its duration is substantial for specialized R&D. Benchmarking this against similar advanced R&D contracts in cutting-edge fields like semiconductor lithography is challenging due to the unique nature of the technology. However, the firm fixed-price structure suggests that the government has negotiated a defined cost for the expected outcomes, which is a positive indicator of value management. The long performance period also allows for amortization of development costs over time.

Cost Per Unit: N/A

Competition Analysis

Competition Level: full-and-open

This contract was awarded under 'Full and Open Competition After Exclusion of Sources,' indicating that while initial sources might have been considered, the final award was made after a broad solicitation. The presence of multiple bidders in such a specialized R&D area would typically drive competitive pricing and innovation. The specific details of the exclusion of sources would need further investigation to fully understand the competitive landscape.

Taxpayer Impact: A full and open competition, even with initial source exclusions, generally benefits taxpayers by fostering a competitive environment that can lead to better pricing and more innovative solutions compared to sole-source awards.

Public Impact

The Department of the Air Force is the primary beneficiary, gaining access to advanced lithography technology. This contract supports the development of next-generation semiconductor manufacturing capabilities. The geographic impact is likely concentrated in areas with advanced research facilities and skilled labor. Workforce implications include highly skilled scientists, engineers, and technicians in specialized fields.

Waste & Efficiency Indicators

Waste Risk Score: 50 / 10

Warning Flags

  • Potential for vendor lock-in if MULTIBEAM CORPORATION is the sole provider of this specific technology.
  • Long contract duration could lead to evolving technological requirements not fully captured in the initial scope.
  • Dependence on a single contractor for critical R&D may pose supply chain risks.

Positive Signals

  • Firm Fixed Price contract provides cost predictability.
  • Long-term commitment signals strategic importance and potential for significant technological advancement.
  • Awarded through a competitive process, suggesting a strong initial value proposition.

Sector Analysis

This contract falls within the Research and Development sector, specifically focusing on advanced physical sciences and engineering, likely related to semiconductor fabrication or microelectronics. The market for advanced lithography is highly specialized, dominated by a few key players globally. The significant investment by the Department of Defense underscores the strategic importance of domestic capabilities in this area, potentially benchmarking against investments in similar national R&D initiatives.

Small Business Impact

The data indicates this contract was not set aside for small businesses (ss: false, sb: false). Given the highly specialized and advanced nature of multi-beam e-beam lithography, it is common for such contracts to be awarded to large, established firms with the necessary expertise and infrastructure. There may be opportunities for small businesses to participate as subcontractors, but the primary award is not directed towards them.

Oversight & Accountability

Oversight for this contract would typically be managed by the contracting officer and program management within the Department of the Air Force. The firm fixed-price nature provides a degree of cost control. Transparency is generally maintained through contract award databases, though specific technical details of the R&D may be sensitive. Inspector General jurisdiction would apply in cases of fraud, waste, or abuse.

Related Government Programs

  • Advanced Manufacturing Technology
  • Semiconductor Research
  • Microelectronics Development
  • National Security Technology Innovation
  • Department of Defense Research Contracts

Risk Flags

  • Long contract duration increases risk of technological obsolescence.
  • Dependence on a single contractor for critical R&D.
  • Potential for evolving requirements impacting scope and cost.
  • Complexity of advanced lithography may lead to unforeseen technical challenges.

Tags

research-and-development, department-of-defense, air-force, california, definitive-contract, firm-fixed-price, full-and-open-competition, advanced-manufacturing, semiconductor-technology, microelectronics, national-security, large-business

Frequently Asked Questions

What is this federal contract paying for?

Department of Defense awarded $32.3 million to MULTIBEAM CORPORATION. IGF::OT::IGF MULTI-E-BEAM LITHOGRAPHY

Who is the contractor on this award?

The obligated recipient is MULTIBEAM CORPORATION.

Which agency awarded this contract?

Awarding agency: Department of Defense (Department of the Air Force).

What is the total obligated amount?

The obligated amount is $32.3 million.

What is the period of performance?

Start: 2017-05-08. End: 2024-03-31.

What is the specific technological advancement expected from this multi-beam e-beam lithography contract?

The contract, valued at $323 million, is for Research and Development in Physical, Engineering, and Life Sciences, specifically related to multi-beam e-beam lithography. This advanced technique is crucial for next-generation semiconductor manufacturing, enabling the creation of smaller, more powerful, and energy-efficient microchips. The expected advancements likely involve increasing the speed and resolution of lithographic processes, potentially reducing manufacturing costs per chip, and enabling the production of chips with novel architectures. This is critical for maintaining a technological edge in areas like artificial intelligence, advanced computing, and defense systems.

How does the $323 million contract value compare to typical R&D spending in advanced lithography?

The $323 million contract value is substantial for a single R&D effort in advanced lithography, reflecting the high cost and complexity of developing cutting-edge semiconductor manufacturing technology. Typical R&D investments in this field can range from tens to hundreds of millions of dollars, often spread across multiple projects and contractors over several years. This specific contract's value suggests a significant, long-term commitment by the Department of the Air Force to advance this particular technology, possibly indicating its critical importance for future defense applications or a strategic effort to bolster domestic semiconductor capabilities.

What are the primary risks associated with a long-duration R&D contract like this?

Long-duration R&D contracts, such as this 2519-day (approximately 7-year) award, carry inherent risks. Technological obsolescence is a major concern; the field of lithography evolves rapidly, and the technology developed under this contract might be surpassed before its full potential is realized or commercialized. Contractor performance risk is also present; unforeseen technical challenges or management issues could delay progress or increase costs, although the firm fixed-price structure aims to mitigate cost overruns. Furthermore, shifts in government priorities or budget constraints could impact the program's continuation. Dependence on a single contractor for such a critical technology also poses a strategic risk.

What does the 'FULL AND OPEN COMPETITION AFTER EXCLUSION OF SOURCES' designation imply for this contract?

This designation indicates that the contract was initially subject to some form of source exclusion, meaning not all potential offerors were initially considered or allowed to bid. However, the subsequent 'Full and Open Competition' phase implies that after this initial exclusion, the solicitation was opened broadly to all responsible sources. This suggests a balance between ensuring specific expertise was considered early on and maintaining a competitive environment for the final award. It implies that while certain initial considerations were made, the government ultimately sought the best value through a wide solicitation process, which is generally positive for price discovery and innovation.

What is the track record of MULTIBEAM CORPORATION in the field of advanced lithography?

Information regarding MULTIBEAM CORPORATION's specific track record in advanced lithography is not detailed in the provided data snippet. However, the award of a $323 million, long-term definitive contract by the Department of the Air Force for R&D in multi-beam e-beam lithography strongly suggests that the company possesses specialized expertise and capabilities deemed essential for this critical technology. The competitive nature of the award implies that their proposal met or exceeded the government's technical and cost requirements compared to other potential bidders. Further due diligence would be required to assess their historical performance on similar government contracts.

How does this contract fit into the broader landscape of federal spending on R&D and advanced manufacturing?

This $323 million contract represents a significant investment within the broader federal R&D and advanced manufacturing portfolio. The Department of Defense is a major funder of R&D, particularly in areas critical to national security, such as microelectronics and advanced materials. This contract aligns with strategic initiatives aimed at strengthening the domestic industrial base, reducing reliance on foreign sources for critical technologies, and maintaining a technological advantage. It complements other federal investments in semiconductor research, manufacturing innovation, and workforce development, contributing to a larger ecosystem designed to foster innovation and economic competitiveness.

Industry Classification

NAICS: Professional, Scientific, and Technical ServicesScientific Research and Development ServicesResearch and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)

Product/Service Code: RESEARCH AND DEVELOPMENTC – National Defense R&D Services

Competition & Pricing

Extent Competed: FULL AND OPEN COMPETITION AFTER EXCLUSION OF SOURCES

Solicitation Procedures: NEGOTIATED PROPOSAL/QUOTE

Offers Received: 1

Pricing Type: FIRM FIXED PRICE (J)

Evaluated Preference: NONE

Contractor Details

Address: 3951 BURTON DR, SANTA CLARA, CA, 95054

Business Categories: Asian Pacific American Owned Business, Category Business, Corporate Entity Not Tax Exempt, Manufacturer of Goods, Minority Owned Business, Small Business, Special Designations, U.S.-Owned Business, Woman Owned Business, Women Owned Small Business

Financial Breakdown

Contract Ceiling: $32,300,000

Exercised Options: $32,300,000

Current Obligation: $32,300,000

Contract Characteristics

Commercial Item: COMMERCIAL PRODUCTS/SERVICES PROCEDURES NOT USED

Cost or Pricing Data: YES

Timeline

Start Date: 2017-05-08

Current End Date: 2024-03-31

Potential End Date: 2026-09-30 00:00:00

Last Modified: 2025-07-31

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