DoD Awards $37.6M for Full-Wafer Patterning R&D to Multibeam Corporation
Contract Overview
Contract Amount: $37,586,245 ($37.6M)
Contractor: Multibeam Corporation
Awarding Agency: Department of Defense
Start Date: 2020-08-20
End Date: 2024-12-30
Contract Duration: 1,593 days
Daily Burn Rate: $23.6K/day
Competition Type: FULL AND OPEN COMPETITION
Number of Offers Received: 1
Pricing Type: COST PLUS FIXED FEE
Sector: R&D
Official Description: FULL-WAFER PATTERNING OF ALL INTERCONNECT LAYERS AT SOP NODES
Place of Performance
Location: SANTA CLARA, SANTA CLARA County, CALIFORNIA, 95054
Plain-Language Summary
Department of Defense obligated $37.6 million to MULTIBEAM CORPORATION for work described as: FULL-WAFER PATTERNING OF ALL INTERCONNECT LAYERS AT SOP NODES Key points: 1. The contract focuses on advanced semiconductor manufacturing techniques. 2. Multibeam Corporation is the sole awardee, raising questions about competition. 3. The R&D nature of the contract implies inherent technical risks. 4. Spending falls within the Research and Development sector.
Value Assessment
Rating: questionable
The contract type is Cost Plus Fixed Fee, which can lead to cost overruns if not managed carefully. Without specific performance metrics or benchmarks for this novel technology, assessing value for money is difficult.
Cost Per Unit: N/A
Competition Analysis
Competition Level: full-and-open
Although stated as full and open competition, the award went to a single entity. This suggests either a highly specialized capability or potential limitations in the solicitation process that may have restricted broader participation.
Taxpayer Impact: Taxpayer funds are supporting cutting-edge research. The ultimate benefit depends on the successful development and potential commercialization of the patterned wafers, which is uncertain at this stage.
Public Impact
Advancement in semiconductor manufacturing capabilities for national security applications. Potential for future technological breakthroughs in microelectronics. Investment in a specialized area of R&D with long-term implications.
Waste & Efficiency Indicators
Waste Risk Score: 50 / 10
Warning Flags
- Lack of clear performance metrics for R&D.
- Potential for cost overruns with CPFF contract.
- Sole awardee despite 'full and open' claim.
Positive Signals
- Supports critical R&D in advanced manufacturing.
- Addresses a specialized technological need.
- Long-term contract duration allows for development.
Sector Analysis
This contract falls under Research and Development in Physical, Engineering, and Life Sciences. Spending in this sector is crucial for technological advancement but often carries higher risk due to the inherent uncertainties of innovation.
Small Business Impact
The contract was not awarded to a small business. Analysis of small business participation is not applicable in this instance.
Oversight & Accountability
The Cost Plus Fixed Fee contract type requires robust oversight to ensure costs are reasonable and allocable to the contract's objectives. The Air Force must monitor progress closely to mitigate risks associated with R&D.
Related Government Programs
- Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
- Department of Defense Contracting
- Department of the Air Force Programs
Risk Flags
- High R&D risk.
- Cost Plus Fixed Fee contract.
- Potential for limited competition despite stated category.
- Uncertainty of technological success and scalability.
Tags
research-and-development-in-the-physical, department-of-defense, ca, definitive-contract, 10m-plus
Frequently Asked Questions
What is this federal contract paying for?
Department of Defense awarded $37.6 million to MULTIBEAM CORPORATION. FULL-WAFER PATTERNING OF ALL INTERCONNECT LAYERS AT SOP NODES
Who is the contractor on this award?
The obligated recipient is MULTIBEAM CORPORATION.
Which agency awarded this contract?
Awarding agency: Department of Defense (Department of the Air Force).
What is the total obligated amount?
The obligated amount is $37.6 million.
What is the period of performance?
Start: 2020-08-20. End: 2024-12-30.
What is the specific technological advantage expected from this full-wafer patterning R&D?
The specific technological advantage sought is likely the ability to pattern all interconnect layers on an entire wafer simultaneously, rather than layer by layer. This could significantly reduce manufacturing time, increase yield, and enable more complex and dense integrated circuits, potentially leading to enhanced performance and reduced costs in future semiconductor production.
What are the primary technical risks associated with developing full-wafer patterning technology?
Primary technical risks include achieving uniform patterning across the entire wafer, managing process variations, ensuring high resolution and accuracy for all interconnect layers, and integrating this novel process into existing semiconductor fabrication workflows. Material compatibility and defect reduction are also significant challenges that could impact the feasibility and scalability of the technology.
How will the effectiveness of this R&D investment be measured?
Effectiveness will likely be measured through a series of technical milestones and deliverables outlined in the contract. This could include demonstrating successful patterning of specific interconnect layers, achieving target resolution and uniformity metrics, successful fabrication of test chips, and ultimately, the potential for scaling the technology to production levels. Independent verification and validation of results will be crucial.
Industry Classification
NAICS: Professional, Scientific, and Technical Services › Scientific Research and Development Services › Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
Product/Service Code: RESEARCH AND DEVELOPMENT › C – National Defense R&D Services
Competition & Pricing
Extent Competed: FULL AND OPEN COMPETITION
Solicitation Procedures: NEGOTIATED PROPOSAL/QUOTE
Solicitation ID: FA865018S1201
Offers Received: 1
Pricing Type: COST PLUS FIXED FEE (U)
Evaluated Preference: NONE
Contractor Details
Address: 3951 BURTON DR, SANTA CLARA, CA, 95054
Business Categories: Asian Pacific American Owned Business, Category Business, Corporate Entity Not Tax Exempt, Manufacturer of Goods, Minority Owned Business, Small Business, Special Designations, U.S.-Owned Business, Woman Owned Business, Women Owned Small Business
Financial Breakdown
Contract Ceiling: $37,586,245
Exercised Options: $37,586,245
Current Obligation: $37,586,245
Contract Characteristics
Commercial Item: COMMERCIAL PRODUCTS/SERVICES PROCEDURES NOT USED
Cost or Pricing Data: YES
Timeline
Start Date: 2020-08-20
Current End Date: 2024-12-30
Potential End Date: 2025-04-23 00:00:00
Last Modified: 2025-04-23
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