NASA awards $255K purchase order for FPGA fabrication to Master International Corporation
Contract Overview
Contract Amount: $25,497 ($25.5K)
Contractor: Master International Corporation
Awarding Agency: National Aeronautics and Space Administration
Start Date: 2026-04-08
End Date: 2026-07-24
Contract Duration: 107 days
Daily Burn Rate: $238/day
Competition Type: COMPETED UNDER SAP
Number of Offers Received: 3
Pricing Type: FIRM FIXED PRICE
Sector: R&D
Official Description: THE PSI MSE LITE NEEDS THE FOLLOWING FPGAS FOR THE FABRICATION OF THE MSE LITE PAYLOAD.
Place of Performance
Location: HAMPTON, HAMPTON CITY County, VIRGINIA, 23681
State: Virginia Government Spending
Plain-Language Summary
National Aeronautics and Space Administration obligated $25,496.75 to MASTER INTERNATIONAL CORPORATION for work described as: THE PSI MSE LITE NEEDS THE FOLLOWING FPGAS FOR THE FABRICATION OF THE MSE LITE PAYLOAD. Key points: 1. Contract awarded for critical components for the MSE Lite payload. 2. Short performance period suggests a focused, urgent need. 3. Fixed-price contract type aims to control costs. 4. Awarded under Simplified Acquisition Procedures (SAP), indicating a smaller value procurement. 5. The North American Industry Classification System (NAICS) code 334413 points to specialized semiconductor manufacturing. 6. Virginia is the state of performance, potentially indicating local economic impact.
Value Assessment
Rating: fair
The contract value of $254,967.50 is relatively small, making direct comparison to larger contracts difficult. As a purchase order under SAP, it suggests a streamlined process. Without more detailed cost breakdowns or market data for these specific FPGAs, a precise value-for-money assessment is challenging. However, the fixed-price nature provides cost certainty for this specific acquisition.
Cost Per Unit: N/A
Competition Analysis
Competition Level: unknown
The contract was 'COMPETED UNDER SAP,' which typically implies a simplified acquisition process that may not involve the same level of broad competition as larger, full-and-open solicitations. The number of bidders is not specified, making it difficult to assess the extent of competition. This method is often used for procurements below certain dollar thresholds where full competition might be less efficient.
Taxpayer Impact: For taxpayers, competition under SAP can offer a balance between efficiency and cost savings. While it may not achieve the lowest possible price compared to a full-and-open competition with many bidders, it generally ensures fair pricing for smaller acquisitions.
Public Impact
The primary beneficiary is NASA, specifically the project requiring the MSE Lite payload. The service delivered is the fabrication of crucial Field-Programmable Gate Arrays (FPGAs). The geographic impact is primarily in Virginia, where the performance is located. This contract supports the advanced technology sector within the aerospace industry.
Waste & Efficiency Indicators
Waste Risk Score: 50 / 10
Warning Flags
- Lack of detailed competition information for SAP procurements.
- Potential for limited price discovery due to simplified acquisition procedures.
- Dependence on a single contractor for critical components without clear alternatives.
Positive Signals
- Fixed-price contract type provides cost predictability.
- Awarded to a company in the semiconductor manufacturing sector.
- Short duration suggests a focused and potentially efficient execution.
Sector Analysis
This contract falls within the Semiconductor and Related Device Manufacturing sector (NAICS 334413). This industry is characterized by high R&D investment, complex manufacturing processes, and a critical role in enabling advanced technologies across various sectors, including aerospace. Spending in this area is often project-specific and tied to the development of sophisticated electronic systems.
Small Business Impact
Information regarding small business set-asides or subcontracting plans is not provided for this purchase order. As it was competed under SAP, it's possible that small business considerations were part of the evaluation, but this is not explicitly stated. The value of the contract may be below thresholds where formal subcontracting goals are mandated.
Oversight & Accountability
Oversight for this purchase order would typically fall under NASA's internal procurement and program management processes. As a relatively small value award, it may not trigger the same level of external oversight or Inspector General review as larger, more complex contracts. Transparency is limited by the nature of SAP awards, with less public detail available compared to major contract vehicles.
Related Government Programs
- NASA Research and Development Contracts
- Aerospace Payload Development
- Semiconductor Fabrication Services
- Electronic Component Procurement
Risk Flags
- Potential supply chain risks for specialized electronic components.
- Limited transparency on competition level due to SAP.
- Need for verification of contractor's specific experience with aerospace-grade FPGAs.
Tags
nasa, purchase-order, semiconductor-manufacturing, fpga, aerospace, virginia, simplified-acquisition-procedures, firm-fixed-price, r&d, master-international-corporation
Frequently Asked Questions
What is this federal contract paying for?
National Aeronautics and Space Administration awarded $25,496.75 to MASTER INTERNATIONAL CORPORATION. THE PSI MSE LITE NEEDS THE FOLLOWING FPGAS FOR THE FABRICATION OF THE MSE LITE PAYLOAD.
Who is the contractor on this award?
The obligated recipient is MASTER INTERNATIONAL CORPORATION.
Which agency awarded this contract?
Awarding agency: National Aeronautics and Space Administration (National Aeronautics and Space Administration).
What is the total obligated amount?
The obligated amount is $25,496.75.
What is the period of performance?
Start: 2026-04-08. End: 2026-07-24.
What is the specific function of the MSE Lite payload and why are these FPGAs critical to its operation?
The provided data does not specify the exact function of the 'MSE Lite payload' or the precise role of the FPGAs within it. However, FPGAs (Field-Programmable Gate Arrays) are integrated circuits designed to be configured by a customer or designer after manufacturing. They are highly versatile and commonly used in aerospace for signal processing, data acquisition, control systems, and custom logic implementation due to their flexibility and performance. Their criticality likely stems from enabling specific, advanced functionalities required for the payload's mission objectives, potentially related to scientific data collection, communication, or system management.
How does the 'COMPETED UNDER SAP' process compare to full and open competition in terms of cost and efficiency for this type of procurement?
Competing under Simplified Acquisition Procedures (SAP) is designed for procurements below certain dollar thresholds (e.g., $250,000 for commercial items, with potential exceptions). It prioritizes efficiency and speed over maximizing competition. Unlike full and open competition, which involves extensive documentation, broad solicitations, and detailed evaluations, SAP often uses methods like GSA Schedules, existing indefinite-delivery/indefinite-quantity (IDIQ) contracts, or requests for quotations from a smaller pool of vendors. For a $255K contract like this, SAP likely resulted in faster award and lower administrative costs. However, it may yield less aggressive pricing compared to a scenario where numerous vendors compete intensely under a full and open solicitation, potentially leading to a slightly higher unit cost but with significant savings in acquisition time and effort.
What are the typical risks associated with procuring specialized semiconductor components like FPGAs, and how might they apply here?
Procuring specialized semiconductor components like FPGAs carries several risks. These include supply chain disruptions (long lead times, manufacturing delays, obsolescence), performance issues (components not meeting specifications, reliability problems), and vendor lock-in. For this contract, the short performance period (approx. 3 months) suggests a need for timely delivery, making supply chain risks significant. The criticality of the components for the MSE Lite payload means that performance failures could jeopardize the entire project. Without details on Master International Corporation's track record with NASA or similar payloads, assessing their reliability is difficult. The fixed-price nature mitigates cost overrun risk for NASA, but performance or schedule risks remain.
What is the historical spending pattern for semiconductor fabrication services by NASA or similar agencies?
Historical spending patterns for semiconductor fabrication services by NASA and similar agencies like the Department of Defense (DoD) are substantial, driven by the need for advanced, often custom, electronic components for space missions, defense systems, and research. Agencies frequently issue contracts for custom chip design, fabrication, testing, and packaging. Spending can range from small, specialized orders like this purchase order to multi-million dollar contracts for large-scale production runs or development of cutting-edge semiconductor technologies. Trends often involve increasing demand for radiation-hardened components for space, higher processing power, and miniaturization. Agencies also invest in domestic semiconductor manufacturing capabilities and supply chain security.
Can Master International Corporation fulfill this contract given its size and the nature of the components?
Master International Corporation, identified by NAICS code 334413, operates within the Semiconductor and Related Device Manufacturing sector. This suggests they possess the general capabilities required for fabricating FPGAs. The contract value of approximately $255,000 and the short duration (107 days) indicate a relatively small-scale or specialized order, which is likely within the capacity of a company in this industry. Without specific information on Master International Corporation's past performance, certifications (e.g., for aerospace-grade components), or production capacity, a definitive assessment is challenging. However, the award implies that NASA's contracting officers determined they were capable of meeting the requirements.
Industry Classification
NAICS: Manufacturing › Semiconductor and Other Electronic Component Manufacturing › Semiconductor and Related Device Manufacturing
Product/Service Code: ELECTRICAL/ELECTRONIC EQPT COMPNTS
Competition & Pricing
Extent Competed: COMPETED UNDER SAP
Solicitation Procedures: SIMPLIFIED ACQUISITION
Solicitation ID: 80NSSC26927128Q
Offers Received: 3
Pricing Type: FIRM FIXED PRICE (J)
Evaluated Preference: NONE
Contractor Details
Address: 2425 S 21ST ST, PHOENIX, AZ, 85034
Business Categories: Category Business, Corporate Entity Not Tax Exempt, Small Business, Special Designations, U.S.-Owned Business
Financial Breakdown
Contract Ceiling: $25,497
Exercised Options: $25,497
Current Obligation: $25,497
Contract Characteristics
Commercial Item: COMMERCIAL PRODUCTS/SERVICES
Timeline
Start Date: 2026-04-08
Current End Date: 2026-07-24
Potential End Date: 2026-07-24 00:00:00
Last Modified: 2026-04-08
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